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1

L2 motivation in focus: the case of Finnish comprehensive school students

Kangasvieri, Teija

Journal:

Language Learning Journal

Year:

2017

Language:

english

File:

PDF, 1.30 MB

english, 2017

2

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. Vähäkangas

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 578 KB

english, 2006

3

Thermomechanically loaded lead‐free LGA joints in LTCC/PWB assemblies

Nousiainen, Olli, Urhonen, Timo, Kangasvieri, Tero, Rautioaho, Risto, Vähäkangas, Jouko

Journal:

Soldering & Surface Mount Technology

Year:

2010

Language:

english

File:

PDF, 336 KB

english, 2010

4

Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead‐free 2nd level interconnections in LTCC/PWB assemblies

Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., Vähäkangas, J.

Journal:

Soldering & Surface Mount Technology

Year:

2010

Language:

english

File:

PDF, 732 KB

english, 2010

5

Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules

Nousiainen, O., Salmela, O., Putaala, J., Kangasvieri, T.

Journal:

Soldering & Surface Mount Technology

Year:

2011

Language:

english

File:

PDF, 390 KB

english, 2011

6

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

Putaala, J., Kangasvieri, T., Nousiainen, O., Jantunen, H., Moilanen, M.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2008

Language:

english

File:

PDF, 3.09 MB

english, 2008

7

[IEEE 2007 IEEE/MTT-S International Microwave Symposium - Honolulu, HI, USA (2007.06.3-2007.06.8)] 2007 IEEE/MTT-S International Microwave Symposium - An Ultra-Wideband BGA-Via Transition for High-Speed Digital and Millimeter-Wave Packaging Applications

Kangasvieri, Tero, Halme, Jukka, Vahakangas, Jouko, Lahti, Markku

Year:

2007

Language:

english

File:

PDF, 3.80 MB

english, 2007

8

Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri, J. Halme, J. Vähäkangas, M. Lahti

Journal:

Microwave and Optical Technology Letters

Year:

2008

Language:

english

File:

PDF, 587 KB

english, 2008

9

Relationship between students' opinions, background factors and learning outcomes: Finnish 9th graders learning English

Härmälä, Marita, Leontjev, Dmitri, Kangasvieri, Teija

Journal:

International Journal of Applied Linguistics

Year:

2017

Language:

english

File:

PDF, 303 KB

english, 2017

10

Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

O. Nousiainen, J. Putaala, T. Kangasvieri, R. Rautioaho, J. Vähäkangas

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 475 KB

english, 2006

11

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies

O. NOUSIAINEN, J. PUTAALA, T. KANGASVIERI, R. RAUTIOAHO, J. VÄHÄKANGAS

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 769 KB

english, 2007

12

Influence of Thermal-Cycling-Induced Failures on the RF Performance of Ceramic Antenna Assemblies

Putaala, J., Nousiainen, O., Komulainen, M., Kangasvieri, T., Jantunen, H., Moilanen, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 825 KB

english, 2011

13

Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model

Putaala, J., Salmela, O., Nousiainen, O., Kangasvieri, T., Uusimaki, A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.07 MB

english, 2012

14

Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly

Nousiainen, O., Kangasvieri, T., Rautioaho, R., Vähäkangas, J.

Journal:

Soldering & Surface Mount Technology

Year:

2008

Language:

english

File:

PDF, 396 KB

english, 2008

15

Kangasvieri, T., Komulainen, M., Jantunen, H., Vahakangas, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.21 MB

english, 2008

16

Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC

Nousiainen, Olli, Kangasvieri, Tero, Rönkä, Kari, Rautioaho, Risto, Vähäkangas, Jouko

Journal:

Soldering & Surface Mount Technology

Year:

2007

Language:

english

File:

PDF, 649 KB

english, 2007

17

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

Nousiainen, O., Kangasvieri, T., Rautioaho, R., Vähäkangas, J.

Journal:

Soldering & Surface Mount Technology

Year:

2011

Language:

english

File:

PDF, 520 KB

english, 2011

18

Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules

Hagberg, Juha, Nousiainen, Olli, Putaala, Jussi, Salmela, Olli, Raumanni, Juha, Rahko, Matti, Kangasvieri, Tero, JÃ¤Ã¤skelÃ¤inen, Jussi, Galkin, Timo, Jantunen, Heli

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 4.75 MB

2020

19

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies

O. Nousiainen, L. Lehtiniemi, T. Kangasvieri, R. Rautioaho, J. Vähäkangas

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 2.31 MB

english, 2008

20

Rovibrational effects on NMR shieldings in a heavy-element system: XeF2

Lantto, Perttu, Kangasvieri, Sanna, Vaara, Juha

Journal:

The Journal of Chemical Physics

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

21

[IEEE 2005 European Microwave Conference - Paris, France (2005.10.4-2005.10.6)] 2005 European Microwave Conference - High performance vertical interconnections for millimeter-wave multichip modules

Kangasvieri, T., Komulainen, M., Jantunen, H., Vahakangas, J.

Year:

2005

Language:

english

File:

PDF, 374 KB

english, 2005

22

Electron correlation and relativistic effects in the secondary NMR isotope shifts of CSe2

Lantto, Perttu, Kangasvieri, Sanna, Vaara, Juha

Journal:

Physical Chemistry Chemical Physics

Year:

2013

Language:

english

File:

PDF, 2.85 MB

english, 2013

23

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Thermo-Mechanical Modeling of Plastic-Core Solder Balls in LTCC/BGA Assemblies

Anttonen, J., Kangasvieri, T., Nousiainen, O., Putaala, J., Vahakangas, J.

Year:

2006

Language:

english

File:

PDF, 4.16 MB

english, 2006

24

Broadband BGA-Via Transitions for Reliable RF/Microwave LTCC-SiP Module Packaging

Kangasvieri, Tero, Halme, Jukka, Vahakangas, Jouko, Lahti, Markku

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2008

Language:

english

File:

PDF, 721 KB

english, 2008

25

[IEEE 2006 European Microwave Integrated Circuits Conference - Manchester, UK (2006.09.10-2006.09.13)] 2006 European Microwave Integrated Circuits Conference - Ultra-Wideband Shielded Vertical Via Transitions from DC up to the V-Band

Kangasvieri, T., Halme, J., Vahakangas, J., Lahti, M.

Year:

2006

Language:

english

File:

PDF, 4.20 MB

english, 2006

26

Design aspects of microwave components with LTCC technique

H. Jantunen, T. Kangasvieri, J. Vähäkangas, S. Leppävuori

Journal:

Journal of the European Ceramic Society

Year:

2003

Language:

english

File:

PDF, 312 KB

english, 2003

27

Power Module Interconnection Reliability in BTS applications

Putaala, Jussi, Hagberg, Juha, Kangasvieri, Tero, Raumanni, Juha, Salmela, Olli, Rahko, Matti, Jaaskelainen, Jussi, Galkin, Timo, Nousiainen, Olli, Jantunen, Heli

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2019

Language:

english

File:

PDF, 1.28 MB

english, 2019

28

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Olli Nousiainen, Tero Kangasvieri, Risto Rautioaho, Jouko Vähäkangas

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 502 KB

english, 2009

29

High-performance vertical transition for broadband and millimetre-wave BGA module packaging

Kangasvieri, T., Halme, J., Vähäkangas, J., Lahti, M.

Journal:

Electronics Letters

Year:

2007

Language:

english

File:

PDF, 153 KB

english, 2007

30

[IEEE 2017 IEEE Conference on Standards for Communications and Networking (CSCN) - Helsinki, Finland (2017.9.18-2017.9.20)] 2017 IEEE Conference on Standards for Communications and Networking (CSCN) - Isolation optimization technique for 5G RF cavity

Islam, Muhammad Nazrul, Hynynen, Lauri, Piiroinen, Mika, Kangasvieri, Tero, Tarvainen, Timo

Year:

2017

Language:

english

File:

PDF, 1.22 MB

english, 2017

31

Miniaturized low-loss Wilkinson power divider for RF front-end module applications

T. Kangasvieri, I. Hautajärvi, H. Jantunen, J. Vähäkangas

Journal:

Microwave and Optical Technology Letters

Year:

2006

Language:

english

File:

PDF, 112 KB

english, 2006

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